Renesas
OEM : Computer and Electronic
Renesas Electronics Corporation delivers trusted embedded design innovation with complete semiconductor solutions that enable billions of connected, intelligent devices to enhance the way people work and live. A global leader in microcontrollers, analog, power, and SoC products, Renesas provides comprehensive solutions for a broad range of automotive, industrial, home electronics, office automation, and information communication technology applications that help shape a limitless future.
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Renesas to Acquire Cellular IoT Technology Leader Sequans Through Tender Offer
Renesas Electronics Corporation (TSE: 6723, “Renesas”), a premier supplier of advanced semiconductor solutions, and Sequans Communications S.A. (NYSE: SQNS, “Sequans”), a leader in 5G/4G cellular IoT chips and modules, today announced that the two companies have entered into a memorandum of understanding (the “MoU”). Pursuant to the terms of the MoU, Renesas will, following consultation of the Sequans’ works council and favorable recommendation by the Sequans Board, commence a tender offer to acquire all outstanding ordinary shares, including American Depositary Shares (ADS) of Sequans for $3.03 per ADS (each ADS representing four ordinary shares) in cash. The transaction values Sequans at approximately $249 million, including net debt, and is expected to close by the first quarter of calendar year 2024, subject to confirmation of tax treatment from relevant authorities, regulatory approvals and other customary closing conditions.
Upon closing of the transaction, Renesas intends to integrate Sequans’ breadth of cellular connectivity products and IP into its core product lineup, including microcontrollers, microprocessors, analog and mixed signal front ends. The acquisition will allow Renesas to immediately expand its reach to the Wide Area Network (WAN) market space encompassing a broad range of data rates. It will also enhance Renesas’ already rich portfolio of Personal Area Network (PAN) and Local Area Network (LAN) connectivity products.
Renesas and Wolfspeed Sign 10 Year Silicon Carbide Wafer Supply Agreement
Renesas Electronics Corporation (TSE:6723, “Renesas”), a premier supplier of advanced semiconductor solutions, and Wolfspeed, Inc. (NYSE: WOLF, “Wolfspeed”), the global leader in silicon carbide technology, today announced the execution of a wafer supply agreement and $2 billion (USD) deposit by Renesas to secure a 10 year supply commitment of silicon carbide bare and epitaxial wafers from Wolfspeed. The supply of high-quality silicon carbide wafers from Wolfspeed will pave the way for Renesas to scale production of silicon carbide power semiconductors starting in 2025. The signing ceremony of the agreement was held at Renesas’ headquarters in Tokyo between Hidetoshi Shibata, President and CEO of Renesas, and Gregg Lowe, President and CEO of Wolfspeed.
Yield Is Top Issue For MicroLEDs
Early test results indicate yield issues at chip transfer, array-to-driver bonding, and other relatively new processes. High cost for this immature technology is keeping microLED displays from making the prototype-to-production leap. And because probers are not well suited to testing thousands of microLED pixels in densely packed arrays, DFT with self-testing is employed, which enables lifecycle testing — at ATE, post-assembly test, and in the field.
For instance, Dialog Semiconductor, a Renesas Company, developed a testing scheme for a white adaptive headlight module containing a 20,000-microLED array with 40µm pitch. “It’s a very good example of how a DFT circuit is not just overhead and cost to buy quality,” said Hans Martin von Staudt, director of Design-for-Test at Renesas. “Instead, it serves a valuable function over the lifetime of the chip. So we needed a DFT scheme with high-diagnostic coverage of the assembly process for pinpointing process weaknesses while enabling in-field monitoring.”
Inspection and testing methods are improving in their ability to identify and segregate out-of-spec product. Mass transfer methods that remove microLED die from wafers or film carriers and position them on IC drivers (for small AR/VR, watch and headlights) or TFT PCBs (for TVs), must easily separate known good die (KGD) from failures and underperforming die.
Yield targets for most microLED display apps are high (see figure 1) because the human eye can quickly spot missing pixels. To put yield targets in perspective, an 8K TV contains 99 million microLED chips. So if the defectivity rate is 0.5%, 520,000 devices must be removed and replaced. Top Engineering estimates this process would take 144 hours, making it cost-prohibitive until repair cost (removal and replacement of individual microLEDs) can be accelerated.