Electronic Design Automation

Assembly Line

AutoDMP Finds Efficient Ways To Place Transistors On Silicon Chips

📅 Date:

🔖 Topics: Electronic Design Automation

🏭 Vertical: Semiconductor

🏢 Organizations: NVIDIA


Macro placement is a critical very large-scale integration (VLSI) physical design problem that significantly impacts the design powerperformance-area (PPA) metrics. This paper proposes AutoDMP, a methodology that leverages DREAMPlace, a GPU-accelerated placer, to place macros and standard cells concurrently in conjunction with automated parameter tuning using a multi-objective hyperparameter optimization technique. As a result, we can generate high-quality predictable solutions, improving the macro placement quality of academic benchmarks compared to baseline results generated from academic and commercial tools. AutoDMP is also computationally efficient, optimizing a design with 2.7 million cells and 320 macros in 3 hours on a single NVIDIA DGX Station A100. This work demonstrates the promise and potential of combining GPU-accelerated algorithms and ML techniques for VLSI design automation

Read more at NVIDIA Research

Synopsys helps semiconductor designers accelerate chip design and development on Google Cloud

📅 Date:

🔖 Topics: Electronic Design Automation

🏢 Organizations: Synopsys, Google


EDA software is a large consumer of high performance computing capacity in the cloud. With the release of Synopsys Cloud bring-your-own-cloud (BYOC) solution on Google Cloud, chip designers can now scale their Google Cloud infrastructure with Synopsys’s leading EDA tools under the flexible FlexEDA pay-per-use model and access unlimited EDA software license availability on-demand by the hour or minute.

Read more at Google Cloud Blog

Designing Billions of Circuits with Code

📅 Date:

🔖 Topics: Electronic Design Automation

🏭 Vertical: Semiconductor

🏢 Organizations: Cadence, Synopsys


Bringing EDA to silicon helped solve daunting challenges in chip making. A chip is built in layers. Now you have to wire connections in 3-D, taking into consideration layer-to-layer connections called vias.

Read more at Asianometry